XC3S1200E-4FGG320I

Xilinx,Inc.

XC3S1200E-4FGG320I

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks
3 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks

XC3S1200E-4FGG320I

Technical Data
Width (mm) 19
Length (mm) 19
Technology CMOS
JESD-30 Code S-PBGA-B320
Organization 2168 CLBS, 1200000 GATES
Package Code BGA
JESD-609 Code e1
Package Shape SQUARE
Package Style (Meter) GRID ARRAY
Surface Mount YES
Terminal Form BALL
Number of CLBs 2168
Terminal Pitch (mm) 1
Terminal Finish TIN SILVER COPPER
Number of Inputs 250
Number of Outputs 194
Seated Height-Max (mm) 2
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Supply Voltage-Max (V) 1.26
Supply Voltage-Min (V) 1.14
Supply Voltage-Nom (V) 1.2
Clock Frequency-Max (MHz) 572
Number of Terminals 320
Qualification Status Not Qualified
Number of Logic Cells 19512
Package Body Material PLASTIC/EPOXY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Equivalence Code BGA320,18X18,40
Operating Temperature-Max (Cel) 100
Operating Temperature-Min (Cel) -40
Moisture Sensitivity Level 3
Number of Equivalent Gates 1200000
Peak Reflow Temperature (Cel) 260
Combinatorial Delay of a CLB-Max (ns) 0.76
Time@Peak Reflow Temperature-Max (s) 30

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