MR25H10CDF

Everspin Technologies, Inc.

MR25H10CDF

Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet MR25H10CDF
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet MR25H10CDF

MRAM 1Mbit Serial-SPI Interface 3.3V 8-Pin DFN EP Tray

Technical Data
Width 5
Length 6
Technology CMOS
JESD-30 Code R-PDSO-N8
Memory Width 8
Organization 128KX8
Package Code HVSON
JESD-609 Code e3
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Surface Mount YES
Terminal Form NO LEAD
Memory Density 1048576
Memory IC Type MEMORY CIRCUIT
Operating Mode SYNCHRONOUS
Terminal Pitch 1.27
Number of Words 131072
Terminal Finish MATTE TIN
Seated Height-Max .9
Temperature Grade INDUSTRIAL
Terminal Position DUAL
Supply Current-Max 27
Number of Functions 1
Number of Terminals 8
Standby Current-Max .000115
Number of Words Code 128K
Qualification Status Not Qualified
Package Body Material PLASTIC/EPOXY
Package Equivalence Code SOLCC8,.25
Operating Temperature-Max 85
Operating Temperature-Min -40
Supply Voltage-Max (Vsup) 3.6
Supply Voltage-Min (Vsup) 2.7
Supply Voltage-Nom (Vsup) 3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215