XC3S400-4FGG320I

Advanced Micro Devices, Inc. (AMD)

XC3S400-4FGG320I

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks
7 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks

IC FPGA 221 I/O 320FBGA

Technical Data
Technology CMOS
Width (mm) 19
Length (mm) 19
JESD-30 Code S-PBGA-B320
Organization 896 CLBS, 400000 GATES
Package Code BGA
Package Shape SQUARE
Package Style (Meter) GRID ARRAY
Surface Mount YES
Terminal Form BALL
J-STD-609 Code e1
Number of CLBs 896
Terminal Finish TIN SILVER COPPER
Number of Inputs 221
DLA Qualification Not Qualified
Number of Outputs 221
Terminal Position BOTTOM
Number of Terminals 320
Terminal Pitch (mm) 1
Number of Logic Cells 8064
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 2
Supply Voltage-Max (V) 1.26
Supply Voltage-Min (V) 1.14
Supply Voltage-Nom (V) 1.2
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Equivalence Code BGA320,18X18,40
Clock Frequency-Max (MHz) 630
Moisture Sensitivity Level 3
Number of Equivalent Gates 400000
Peak Reflow Temperature (Cel) 260
Operating Temperature-Max (Cel) 100
Operating Temperature-Min (Cel) -40
Time@Peak Reflow Temperature-Max (s) 30
Combinatorial Delay of a CLB-Max (ns) 0.61

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