SN74LVC1G17MDCKREP
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Enhanced product single 1.65-V to 6.5-V buffer with Schmitt-Trigger inputs 5-SC70 -55 to 125
| Family | LVC/LCX/Z |
| Technology | CMOS |
| Width (mm) | 1.25 |
| Length (mm) | 2 |
| JESD-30 Code | R-PDSO-G5 |
| Package Code | TSSOP |
| Logic IC Type | BUFFER |
| Package Shape | RECTANGULAR |
| Package Style (Meter) | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Surface Mount | YES |
| Terminal Form | GULL WING |
| J-STD-609 Code | e4 |
| Packing Method | TR |
| Schmitt Trigger | YES |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Number of Inputs | 1 |
| DLA Qualification | Not Qualified |
| Temperature Grade | MILITARY |
| Terminal Position | DUAL |
| Number of Functions | 1 |
| Number of Terminals | 5 |
| Terminal Pitch (mm) | 0.65 |
| Load Capacitance (pF) | 50 |
| Package Body Material | PLASTIC/EPOXY |
| Propagation Delay (ns) | 11 |
| Seated Height-Max (mm) | 1.1 |
| Supply Voltage-Max (V) | 6.5 |
| Supply Voltage-Min (V) | 1.65 |
| Supply Voltage-Nom (V) | 3.3 |
| Supply Current-Max (mA) | 0.01 |
| Package Equivalence Code | TSSOP5/6,.08 |
| Moisture Sensitivity Level | 1 |
| Output Low Current-Max (mA) | 32 |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature-Max (Cel) | 125 |
| Operating Temperature-Min (Cel) | -55 |
| Propagation Delay-Max@Nom-Sup (ns) | 5.5 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Number of Elements | 1 |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200