XC7A100T-2FGG676I
Availability
Design risk
Price trend
Lead time
AMD XILINX - XC7A100T-2FGG676I - FPGA, ARTIX-7, 300 I/O, FCBGA-676
| Width (mm) | 27 |
| Length (mm) | 27 |
| Technology | CMOS |
| JESD-30 Code | S-PBGA-B676 |
| Organization | 7925 CLBS |
| Package Code | BGA |
| JESD-609 Code | e1 |
| Package Shape | SQUARE |
| Package Style (Meter) | GRID ARRAY |
| Surface Mount | YES |
| Terminal Form | BALL |
| Number of CLBs | 7925 |
| Terminal Pitch (mm) | 1 |
| Terminal Finish | TIN SILVER COPPER |
| Number of Inputs | 300 |
| Number of Outputs | 300 |
| Seated Height-Max (mm) | 2.44 |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Supply Voltage-Max (V) | 1.05 |
| Supply Voltage-Min (V) | 0.95 |
| Supply Voltage-Nom (V) | 1 |
| Clock Frequency-Max (MHz) | 1286 |
| Number of Terminals | 676 |
| Qualification Status | Not Qualified |
| Number of Logic Cells | 101440 |
| Package Body Material | PLASTIC/EPOXY |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Package Equivalence Code | BGA676,26X26,40 |
| Operating Temperature-Max (Cel) | 100 |
| Operating Temperature-Min (Cel) | -40 |
| Moisture Sensitivity Level | 3 |
| Peak Reflow Temperature (Cel) | 250 |
| Combinatorial Delay of a CLB-Max (ns) | 1.05 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
Submit request
CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200