MT47H32M16NF-25E:H
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DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin FBGA Tray
I/O Type | COMMON |
Technology | CMOS |
Width (mm) | 8.0000 |
Access Mode | FOUR BANK PAGE BURST |
Length (mm) | 12.5000 |
JESD-30 Code | R-PBGA-B84 |
Memory Width | 16 |
Package Code | TFBGA |
Self Refresh | YES |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Surface Mount | YES |
Terminal Form | BALL |
J-STD-609 Code | e1 |
Memory IC Type | DDR2 DRAM |
Operating Mode | SYNCHRONOUS |
Refresh Cycles | 8192 |
Number of Ports | 1 |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
DLA Qualification | Not Qualified |
Temperature Grade | OTHER |
Terminal Position | BOTTOM |
Additional Feature | AUTO/SELF REFRESH |
Memory Organization | 32MX16 |
Number of Functions | 1 |
Number of Terminals | 84 |
Terminal Pitch (mm) | 0.800 |
Access Time-Max (ns) | 0.4000000000000000 |
Number of Words Code | 32M |
Memory Density (bits) | 536870912.0000000000000000 |
Package Body Material | PLASTIC/EPOXY |
Output Characteristics | 3-STATE |
Seated Height-Max (mm) | 1.2000 |
Supply Voltage-Max (V) | 1.90000 |
Supply Voltage-Min (V) | 1.70000 |
Supply Voltage-Nom (V) | 1.8 |
Number of Words (words) | 33554432.0000000000000000 |
Sequential Burst Length | 4,8 |
Standby Current-Max (A) | 0.010000000000000 |
Supply Current-Max (mA) | 215.000000000000000 |
Interleaved Burst Length | 4,8 |
Package Equivalence Code | BGA84,9X15,32 |
Clock Frequency-Max (MHz) | 400.00000 |
Peak Reflow Temperature (Cel) | 260 |
Operating Temperature-Max (Cel) | 85.0 |
Operating Temperature-Min (Cel) | 0.0 |
Time@Peak Reflow Temperature-Max (s) | 30 |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200