TPS82671SIPR

Texas Instruments Incorporated

TPS82671SIPR

Availability

Design risk

Price trend

Lead time

Semiconductors

Power Supply Modules

Lead time 6 weeks
Data sheet TPS82671SIPR
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Availability

Design risk

Price trend

Lead time

Semiconductors

Power Supply Modules

Lead time 6 weeks
Data sheet TPS82671SIPR

600mA Fully Integrated, Low Noise Step-Down Converter Module in MicroSiP™ Package 8-uSiP -40 to 85

Technical Data
Width (mm) 2.3
Length (mm) 2.9
Control Mode VOLTAGE-MODE
JESD-30 Code R-PBGA-B8
Package Code VFBGA
Package Shape RECTANGULAR
Package Style (Meter) GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
J-STD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Control Technique PULSE WIDTH MODULATION
DLA Qualification Not Qualified
Number of Outputs 1
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Additional Feature ALSO HAS CONTROL TECHNIQUE OF PFM
Number of Functions 1
Number of Terminals 8
Terminal Pitch (mm) 0.8
Input Voltage-Max (V) 4.8
Input Voltage-Min (V) 2.3
Input Voltage-Nom (V) 3.6
Package Body Material PLASTIC/EPOXY
Analog IC - Other Type SWITCHING REGULATOR
Output Current-Max (A) 0.6
Output Voltage-Max (V) 1.8
Output Voltage-Min (V) 1.8
Output Voltage-Nom (V) 1.8
Seated Height-Max (mm) 1
Switcher Configuration BUCK
Package Equivalence Code BGA8,3X3,40/32
Moisture Sensitivity Level 2
Peak Reflow Temperature (Cel) 260
Switching Frequency-Max (kHz) 6000
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40
Time@Peak Reflow Temperature-Max (s) 30

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