W25Q512JVBIQ

Winbond Electronics Corporation

W25Q512JVBIQ

Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet W25Q512JVBIQ
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet W25Q512JVBIQ

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 512M-bit 64M x 8 6.5ns 24-Pin TFBGA Tube

Technical Data
Type NOR TYPE
Technology CMOS
Width (mm) 6.0000
Length (mm) 8.0000
JESD-30 Code R-PBGA-B24
Memory Width 8
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Surface Mount YES
Terminal Form BALL
Memory IC Type FLASH
Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type SPI
Write Protection HARDWARE/SOFTWARE
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Additional Feature ALSO OPERATES AT 2.7VMIN @104MHZ
Memory Organization 64MX8
Number of Functions 1
Number of Terminals 24
Terminal Pitch (mm) 1.000
Number of Words Code 64M
Memory Density (bits) 536870912.0000000000000000
Package Body Material PLASTIC/EPOXY
Alternate Memory Width 4
Output Characteristics 3-STATE
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 3.00000
Supply Voltage-Nom (V) 3
Data Retention Time-Min 20
Number of Words (words) 67108864.0000000000000000
Programming Voltage (V) 3
Standby Current-Max (A) 0.000060000000000
Supply Current-Max (mA) 40.000000000000000
Package Equivalence Code BGA24,5X5,40
Clock Frequency-Max (MHz) 133.00000
Endurance (Write/Erase Cycles) 100000.000000000000000
Operating Temperature-Max (Cel) 85.0
Operating Temperature-Min (Cel) -40.0

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Sourceability North America, LLC

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Austin, TX 78758-5215