XC6SLX150-3FGG676C

Advanced Micro Devices, Inc. (AMD)

XC6SLX150-3FGG676C

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks
7 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks

IC FPGA 498 I/O 676FBGA

Technical Data
Technology CMOS
Width (mm) 27
Length (mm) 27
JESD-30 Code S-PBGA-B676
Organization 11519 CLBS
Package Code BGA
Package Shape SQUARE
Package Style (Meter) GRID ARRAY
Surface Mount YES
Terminal Form BALL
J-STD-609 Code e1
Number of CLBs 11519
Terminal Finish TIN SILVER COPPER
Number of Inputs 498
DLA Qualification Not Qualified
Number of Outputs 498
Temperature Grade OTHER
Terminal Position BOTTOM
Number of Terminals 676
Terminal Pitch (mm) 1
Number of Logic Cells 147443
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 2.44
Supply Voltage-Max (V) 1.26
Supply Voltage-Min (V) 1.14
Supply Voltage-Nom (V) 1.2
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Equivalence Code BGA676,26X26,40
Clock Frequency-Max (MHz) 862
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) 0
Time@Peak Reflow Temperature-Max (s) 30
Combinatorial Delay of a CLB-Max (ns) 0.21

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