THGBMNG5D1LBAIT

Toshiba Corporation

THGBMNG5D1LBAIT

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Design risk

Price trend

Lead time

Semiconductors

Flash Memories

Lead time 6 weeks
1 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Flash Memories

Lead time 6 weeks

eMMC 4gb v5.0 emmc 11.0x10.0mm

Technical Data
Type MLC NAND TYPE
Technology CMOS
Width (mm) 10
Length (mm) 11
JESD-30 Code R-PBGA-B153
Memory Width 8
Package Code VFBGA
Package Shape RECTANGULAR
Package Style (Meter) GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
Memory IC Type Embedded MMC
Operating Mode ASYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type EMMC 5.0
Temperature Grade OTHER
Terminal Position BOTTOM
Memory Organization 4GX8
Number of Functions 1
Number of Terminals 153
Terminal Pitch (mm) 0.5
Number of Words Code 4G
Memory Density (bits) 34359738368
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 0.8
Supply Voltage-Max (V) 3.6
Supply Voltage-Min (V) 2.7
Supply Voltage-Nom (V) 3.3
Number of Words (words) 4294967296
Programming Voltage (V) 3.3
Package Equivalence Code BGA153,14X14,20
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -25

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