MT47H64M16NF-25E:M

Micron Technology

MT47H64M16NF-25E:M

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Semiconductors

Memory ICs

Lead time 6 weeks
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks

DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin FBGA Tray

Technical Data
I/O Type COMMON
Technology CMOS
Width (mm) 8.0000
Access Mode MULTI BANK PAGE BURST
Length (mm) 12.5000
JESD-30 Code R-PBGA-B84
Memory Width 16
Package Code TFBGA
Self Refresh YES
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
J-STD-609 Code e1
Memory IC Type DDR2 DRAM
Operating Mode SYNCHRONOUS
Refresh Cycles 8192
Number of Ports 1
Terminal Finish TIN SILVER COPPER
DLA Qualification Not Qualified
Temperature Grade OTHER
Terminal Position BOTTOM
Memory Organization 64MX16
Number of Functions 1
Number of Terminals 84
Terminal Pitch (mm) 0.800
Access Time-Max (ns) 0.4000000000000000
Number of Words Code 64M
Memory Density (bits) 1073741824.0000000000000000
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 1.90000
Supply Voltage-Min (V) 1.70000
Supply Voltage-Nom (V) 1.8
Number of Words (words) 67108864.0000000000000000
Sequential Burst Length 4,8
Standby Current-Max (A) 0.010000000000000
Supply Current-Max (mA) 260.000000000000000
Interleaved Burst Length 4,8
Package Equivalence Code BGA84,9X15,32
Clock Frequency-Max (MHz) 400.00000
Peak Reflow Temperature (Cel) 260
Operating Temperature-Max (Cel) 85.0
Operating Temperature-Min (Cel) 0.0
Time@Peak Reflow Temperature-Max (s) 30

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