XC3S500E-4FTG256C

Advanced Micro Devices, Inc. (AMD)

XC3S500E-4FTG256C

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks
7 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Field Programmable Gate Arrays

Lead time 6 weeks

FPGA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA

Technical Data
Technology CMOS
Width (mm) 17
Length (mm) 17
JESD-30 Code S-PBGA-B256
Organization 1164 CLBS, 500000 GATES
Package Code LBGA
Package Shape SQUARE
Package Style (Meter) GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Form BALL
J-STD-609 Code e1
Number of CLBs 1164
Terminal Finish TIN SILVER COPPER
Number of Inputs 190
DLA Qualification Not Qualified
Number of Outputs 149
Temperature Grade OTHER
Terminal Position BOTTOM
Number of Terminals 256
Terminal Pitch (mm) 1
Number of Logic Cells 10476
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 1.55
Supply Voltage-Max (V) 1.26
Supply Voltage-Min (V) 1.14
Supply Voltage-Nom (V) 1.2
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Equivalence Code BGA256,16X16,40
Clock Frequency-Max (MHz) 572
Moisture Sensitivity Level 3
Number of Equivalent Gates 500000
Peak Reflow Temperature (Cel) 260
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) 0
Time@Peak Reflow Temperature-Max (s) 30
Combinatorial Delay of a CLB-Max (ns) 0.76

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