MR25H40CDFR

Everspin Technologies, Inc.

MR25H40CDFR

Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet MR25H40CDFR
0 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet MR25H40CDFR

MRAM 4Mbit Serial-SPI Interface 3.3V 8-Pin DFN EP T/R

Technical Data
Technology CMOS
Width (mm) 5.0000
Length (mm) 6.0000
JESD-30 Code R-PDSO-N8
Memory Width 8
Package Code HVSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Surface Mount YES
Terminal Form NO LEAD
Memory IC Type MRAM
Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type SPI
DLA Qualification Not Qualified
Temperature Grade INDUSTRIAL
Terminal Position DUAL
Memory Organization 512KX8
Number of Functions 1
Number of Terminals 8
Terminal Pitch (mm) 1.270
Number of Words Code 512K
Memory Density (bits) 4194304.0000000000000000
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 0.9000
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 3.00000
Supply Voltage-Nom (V) 3.3
Number of Words (words) 524288.0000000000000000
Package Equivalence Code SOLCC8,.25
Clock Frequency-Max (MHz) 40.00000
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Operating Temperature-Max (Cel) 85.0
Operating Temperature-Min (Cel) -40.0

Submit request

CONTACT REASON

Connect with us

Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215