BGM113A256V2

Silicon Laboratories, Inc.

BGM113A256V2

Availability

Design risk

Price trend

Lead time

Semiconductors

Other RF/Microwave Devices

Lead time 6 weeks
Data sheet BGM113A256V2
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Availability

Design risk

Price trend

Lead time

Semiconductors

Other RF/Microwave Devices

Lead time 6 weeks
Data sheet BGM113A256V2

BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna

Technical Data
Width (mm) 9.1500
Length (mm) 15.7300
JESD-30 Code R-XXMA-N36
Package Code XMA
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Surface Mount YES
Terminal Form NO LEAD
Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Position UNSPECIFIED
Number of Functions 1
Number of Terminals 36
Terminal Pitch (mm) 0.800
Package Body Material UNSPECIFIED
Seated Height-Max (mm) 2.0000
Supply Voltage-Nom (V) 3.3000000000000000
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40

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Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215