EPC2TI32N

Intel Corporation

EPC2TI32N

Availability

Design risk

Price trend

Lead time

Semiconductors

PROMs

Lead time 6 weeks
Data sheet EPC2TI32N
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Availability

Design risk

Price trend

Lead time

Semiconductors

PROMs

Lead time 6 weeks
Data sheet EPC2TI32N

FPGA - Configuration Memory IC - Ser. Config Mem Flash 1.6Mb 10 MHz

Technical Data
Width (mm) 7
Length (mm) 7
Technology CMOS
JESD-30 Code S-PQFP-G32
Memory Width 1
Organization 1695680X1
Package Code TQFP
JESD-609 Code e3
Package Shape SQUARE
Package Style (Meter) FLATPACK, THIN PROFILE
Surface Mount YES
Terminal Form GULL WING
Memory Density (bit) 1695680
Memory IC Type CONFIGURATION MEMORY
Operating Mode SYNCHRONOUS
Terminal Pitch (mm) 0.8
Number of Words (words) 1695680
Parallel/Serial SERIAL
Terminal Finish MATTE TIN
Seated Height-Max (mm) 1.2
Temperature Grade INDUSTRIAL
Terminal Position QUAD
Additional Feature IT ALSO REQUIRES 5V NOMINAL SUPPLY
Supply Current-Max (mA) 50
Number of Functions 1
Number of Terminals 32
Programming Voltage (V) 3.3
Standby Current-Max (Amp) 0.0001
Number of Words Code 1695680
Qualification Status Not Qualified
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Package Equivalence Code TQFP32,.35SQ,32
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40
Supply Voltage-Max (Vsup) (V) 3.6
Supply Voltage-Min (Vsup) (V) 3
Supply Voltage-Nom (Vsup) (V) 3.3
Moisture Sensitivity Level 3

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