S29GL256S90TFI020

INFINEON TECHNOLOGIES AG

S29GL256S90TFI020

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Design risk

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Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks

NOR Flash Parallel 3V/3.3V 256M-bit 16M x 16 90ns 56-Pin TSOP Tray

Technical Data
Type NOR TYPE
Ready/Busy YES
Technology CMOS
Toggle Bit YES
Width (mm) 14.0000
Length (mm) 18.4000
Data Polling YES
JESD-30 Code R-PDSO-G56
Memory Width 16
Package Code TSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Surface Mount YES
Terminal Form GULL WING
J-STD-609 Code e3
Memory IC Type FLASH
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL
Terminal Finish Matte Tin (Sn)
Page Size (words) 16
Terminal Position DUAL
Memory Organization 16MX16
Number of Functions 1
Number of Terminals 56
Sector Size (words) 64K
Terminal Pitch (mm) 0.500
Access Time-Max (ns) 90.0000000000000000
Number of Words Code 16M
Memory Density (bits) 268435456.0000000000000000
Package Body Material PLASTIC/EPOXY
Command User Interface YES
Common Flash Interface YES
Number of Sectors/Size 256
Output Characteristics 3-STATE
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 2.70000
Supply Voltage-Nom (V) 3
Data Retention Time-Min 20
Number of Words (words) 16777216.0000000000000000
Programming Voltage (V) 3
Standby Current-Max (A) 0.000100000000000
Supply Current-Max (mA) 100.000000000000000
Package Equivalence Code TSSOP56,.78,20
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Endurance (Write/Erase Cycles) 100000.000000000000000
Operating Temperature-Max (Cel) 85.0
Operating Temperature-Min (Cel) -40.0
Time@Peak Reflow Temperature-Max (s) 30

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Sourceability North America, LLC

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Austin, TX 78758-5215