MT48LC16M16A2P-6A:G

Micron Technology

MT48LC16M16A2P-6A:G

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Semiconductors

Memory ICs

Lead time 6 weeks
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks

DRAM Chip SDR SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II Tray

Technical Data
I/O Type COMMON
Technology CMOS
Width (mm) 10.1600
Access Mode FOUR BANK PAGE BURST
Length (mm) 22.2200
JESD-30 Code R-PDSO-G54
Memory Width 16
Package Code TSOP2
Self Refresh YES
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Surface Mount YES
Terminal Form GULL WING
J-STD-609 Code e3
Memory IC Type SYNCHRONOUS DRAM
Operating Mode SYNCHRONOUS
Refresh Cycles 8192
Number of Ports 1
Terminal Finish MATTE TIN
DLA Qualification Not Qualified
Temperature Grade COMMERCIAL
Terminal Position DUAL
Additional Feature AUTO/SELF REFRESH
Memory Organization 16MX16
Number of Functions 1
Number of Terminals 54
Terminal Pitch (mm) 0.800
Access Time-Max (ns) 5.4000000000000000
Number of Words Code 16M
Memory Density (bits) 268435456.0000000000000000
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 3.00000
Supply Voltage-Nom (V) 3.3
Number of Words (words) 16777216.0000000000000000
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max (A) 0.002500000000000
Supply Current-Max (mA) 150.000000000000000
Interleaved Burst Length 1,2,4,8
Package Equivalence Code TSOP54,.46,32
Clock Frequency-Max (MHz) 167.00000
Peak Reflow Temperature (Cel) 260
Operating Temperature-Max (Cel) 70.0
Operating Temperature-Min (Cel) 0.0
Time@Peak Reflow Temperature-Max (s) 30
Configuration x 16

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