W971GG6NB25I

Winbond Electronics Corporation

W971GG6NB25I

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Design risk

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Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet W971GG6NB25I
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet W971GG6NB25I

DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin VFBGA

Technical Data
I/O Type COMMON
Technology CMOS
Width (mm) 8.0000
Access Mode MULTI BANK PAGE BURST
Length (mm) 12.5000
JESD-30 Code R-PBGA-B84
Memory Width 16
Package Code VFBGA
Self Refresh YES
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
Memory IC Type DDR2 DRAM
Operating Mode SYNCHRONOUS
Number of Ports 1
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Memory Organization 64MX16
Number of Functions 1
Number of Terminals 84
Terminal Pitch (mm) 0.800
Number of Words Code 64M
Memory Density (bits) 1073741824.0000000000000000
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 1.0000
Supply Voltage-Max (V) 1.90000
Supply Voltage-Min (V) 1.70000
Supply Voltage-Nom (V) 1.8
Number of Words (words) 67108864.0000000000000000
Sequential Burst Length 4,8
Standby Current-Max (A) 0.008000000000000
Supply Current-Max (mA) 140.000000000000000
Interleaved Burst Length 4,8
Package Equivalence Code BGA84,9X15,32
Clock Frequency-Max (MHz) 125.00000
Operating Temperature-Max (Cel) 95.0
Operating Temperature-Min (Cel) -40.0

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Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215