W25Q64JVSSIQ

Winbond Electronics Corporation

W25Q64JVSSIQ

Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet W25Q64JVSSIQ
10 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
Data sheet W25Q64JVSSIQ

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 6ns 8-Pin SOIC Tube

Technical Data
Type NOR TYPE
Technology CMOS
Width (mm) 5.2300
Length (mm) 5.2300
JESD-30 Code S-PDSO-G8
Memory Width 8
Package Code SOP
Package Shape SQUARE
Package Style SMALL OUTLINE
Surface Mount YES
Terminal Form GULL WING
J-STD-609 Code e3
Memory IC Type FLASH
Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type QSPI
Terminal Finish MATTE TIN
Write Protection HARDWARE/SOFTWARE
Temperature Grade INDUSTRIAL
Terminal Position DUAL
Additional Feature 2.7V TO 3V @ 104MHZ
Memory Organization 8MX8
Number of Functions 1
Number of Terminals 8
Terminal Pitch (mm) 1.270
Number of Words Code 8M
Memory Density (bits) 67108864.0000000000000000
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 2.1600
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 2.70000
Supply Voltage-Nom (V) 3
Data Retention Time-Min 20
Number of Words (words) 8388608.0000000000000000
Programming Voltage (V) 3
Standby Current-Max (A) 0.000050000000000
Supply Current-Max (mA) 20.000000000000000
Package Equivalence Code SOP8,.3
Clock Frequency-Max (MHz) 133.00000
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Endurance (Write/Erase Cycles) 100000.000000000000000
Operating Temperature-Max (Cel) 85.0
Operating Temperature-Min (Cel) -40.0
Time@Peak Reflow Temperature-Max (s) 30

Submit request

CONTACT REASON

Connect with us

Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215