THGBMJG6C1LBAU7
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MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100
| Type | MLC NAND TYPE |
| Technology | CMOS |
| Width (mm) | 11.5000 |
| Length (mm) | 13.0000 |
| JESD-30 Code | R-PBGA-B153 |
| Memory Width | 8 |
| Package Code | TFBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Surface Mount | YES |
| Terminal Form | BALL |
| Memory IC Type | Embedded MMC |
| Operating Mode | ASYNCHRONOUS |
| Parallel/Serial | SERIAL |
| Serial Bus Type | EMMC 5.1 |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Memory Organization | 8GX8 |
| Number of Functions | 1 |
| Number of Terminals | 153 |
| Terminal Pitch (mm) | 0.500 |
| Number of Words Code | 8G |
| Memory Density (bits) | 68719476736.0000000000000000 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 1.2000 |
| Supply Voltage-Max (V) | 3.60000 |
| Supply Voltage-Min (V) | 2.70000 |
| Supply Voltage-Nom (V) | 3.3 |
| Number of Words (words) | 8589934592.0000000000000000 |
| Programming Voltage (V) | 3.3 |
| Supply Current-Max (mA) | 40.000000000000000 |
| Package Equivalence Code | BGA153,14X14,20 |
| Clock Frequency-Max (MHz) | 52.00000 |
| Operating Temperature-Max (Cel) | 105.0 |
| Operating Temperature-Min (Cel) | -40.0 |
| Screening Level / Reference Standard | AEC-Q100 |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200