NT5CC256M16ER-EK
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DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin TFBGA
I/O Type | COMMON |
Technology | CMOS |
Width (mm) | 8 |
Access Mode | MULTI BANK PAGE BURST |
Length (mm) | 13 |
JESD-30 Code | R-PBGA-B96 |
Memory Width | 16 |
Package Code | TFBGA |
Self Refresh | YES |
Package Shape | RECTANGULAR |
Package Style (Meter) | GRID ARRAY, THIN PROFILE, FINE PITCH |
Surface Mount | YES |
Terminal Form | BALL |
Memory IC Type | DDR3L DRAM |
Operating Mode | SYNCHRONOUS |
Refresh Cycles | 8192 |
Number of Ports | 1 |
Temperature Grade | OTHER |
Terminal Position | BOTTOM |
Additional Feature | AUTO/SELF REFRESH |
Memory Organization | 256MX16 |
Number of Functions | 1 |
Number of Terminals | 96 |
Terminal Pitch (mm) | 0.8 |
Number of Words Code | 256M |
Memory Density (bits) | 4294967296 |
Package Body Material | PLASTIC/EPOXY |
Output Characteristics | 3-STATE |
Seated Height-Max (mm) | 1.2 |
Supply Voltage-Max (V) | 1.45 |
Supply Voltage-Min (V) | 1.283 |
Supply Voltage-Nom (V) | 1.35 |
Number of Words (words) | 268435456 |
Sequential Burst Length | 8 |
Standby Current-Max (A) | 0.023 |
Supply Current-Max (mA) | 155 |
Interleaved Burst Length | 8 |
Package Equivalence Code | BGA96,9X16,32 |
Clock Frequency-Max (MHz) | 933 |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Operating Temperature-Max (Cel) | 95 |
Operating Temperature-Min (Cel) | 0 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200