W25Q64JVSSIQTR

Winbond Electronics Corporation

W25Q64JVSSIQTR

Availability

Design risk

Price trend

Lead time

Semiconductors

Flash Memories

Lead time 6 weeks
Data sheet W25Q64JVSSIQTR
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Availability

Design risk

Price trend

Lead time

Semiconductors

Flash Memories

Lead time 6 weeks
Data sheet W25Q64JVSSIQTR

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 6ns 8-Pin SOIC T/R

Technical Data
Type NOR TYPE
Technology CMOS
Width (mm) 5.28
Length (mm) 5.28
JESD-30 Code S-PDSO-G8
Memory Width 8
Package Code SOP
Package Shape SQUARE
Package Style (Meter) SMALL OUTLINE
Surface Mount YES
Terminal Form GULL WING
J-STD-609 Code e3
Memory IC Type FLASH
Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type SPI
Terminal Finish MATTE TIN
Write Protection HARDWARE/SOFTWARE
Terminal Position DUAL
Additional Feature 2.7V TO 3V @ 104MHZ
Memory Organization 8MX8
Number of Functions 1
Number of Terminals 8
Terminal Pitch (mm) 1.27
Number of Words Code 8M
Memory Density (bits) 67108864
Package Body Material PLASTIC/EPOXY
Alternate Memory Width 1
Output Characteristics 3-STATE
Seated Height-Max (mm) 2.16
Supply Voltage-Max (V) 3.6
Supply Voltage-Min (V) 3
Supply Voltage-Nom (V) 3
Data Retention Time-Min 20
Number of Words (words) 8388608
Programming Voltage (V) 3
Standby Current-Max (A) 5.0E-5
Supply Current-Max (mA) 20
Package Equivalence Code SOP8,.3
Clock Frequency-Max (MHz) 133
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Endurance (Write/Erase Cycles) 100000
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40
Time@Peak Reflow Temperature-Max (s) 30

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Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215