MCIMX6Q5EYM10AD
Availability
Design risk
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SoC, CMOS, PBGA624
Technology | CMOS |
Width (mm) | 21 |
Length (mm) | 21 |
JESD-30 Code | S-PBGA-B624 |
Package Code | LFBGA |
Package Shape | SQUARE |
Package Style (Meter) | GRID ARRAY, LOW PROFILE, FINE PITCH |
Surface Mount | YES |
Terminal Form | BALL |
J-STD-609 Code | e1 |
Terminal Finish | TIN SILVER COPPER |
Temperature Grade | OTHER |
Terminal Position | BOTTOM |
Additional Feature | 24MHZ NOMINAL FREQ AVAILABLE |
Number of Terminals | 624 |
Terminal Pitch (mm) | 0.8 |
Package Body Material | PLASTIC/EPOXY |
Seated Height-Max (mm) | 1.6 |
Supply Voltage-Max (V) | 1.5 |
Supply Voltage-Min (V) | 1.35 |
Moisture Sensitivity Level | 3 |
uPs/uCs/Peripheral ICs Type | SoC |
Operating Temperature-Max (Cel) | 105 |
Operating Temperature-Min (Cel) | -20 |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200