MCIMX258CJM4A
Availability
Design risk
Price trend
Lead time
SoC, CMOS, PBGA400
| Technology | CMOS |
| Width (mm) | 17 |
| Length (mm) | 17 |
| JESD-30 Code | S-PBGA-B400 |
| Package Code | LFBGA |
| Package Shape | SQUARE |
| Package Style (Meter) | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Surface Mount | YES |
| Terminal Form | BALL |
| Terminal Finish | TIN SILVER COPPER OVER NICKEL |
| DLA Qualification | Not Qualified |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Additional Feature | ALSO REQUIRES 3.3 V I/O SUPPLY |
| Number of Terminals | 400 |
| Terminal Pitch (mm) | 0.8 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 1.6 |
| Supply Voltage-Max (V) | 1.52 |
| Supply Voltage-Min (V) | 1.38 |
| Supply Voltage-Nom (V) | 1.45 |
| Package Equivalence Code | BGA400,20X20,32 |
| Moisture Sensitivity Level | 3 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature-Max (Cel) | 85 |
| Operating Temperature-Min (Cel) | -40 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
Submit request
CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200