MT41K256M8DA-107:KTR
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DRAM Chip DDR3L SDRAM 2Gbit 256Mx8 1.35V 78-Pin FBGA Tray
| Technology | CMOS |
| Width (mm) | 8.0000 |
| Access Mode | MULTI BANK PAGE BURST |
| Length (mm) | 10.5000 |
| JESD-30 Code | R-PBGA-B78 |
| Memory Width | 8 |
| Package Code | TFBGA |
| Self Refresh | YES |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Surface Mount | YES |
| Terminal Form | BALL |
| J-STD-609 Code | e1 |
| Memory IC Type | DDR3L DRAM |
| Operating Mode | SYNCHRONOUS |
| Number of Ports | 1 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Temperature Grade | OTHER |
| Terminal Position | BOTTOM |
| Additional Feature | AUTO/SELF REFRESH |
| Memory Organization | 256MX8 |
| Number of Functions | 1 |
| Number of Terminals | 78 |
| Terminal Pitch (mm) | 0.800 |
| Number of Words Code | 256M |
| Memory Density (bits) | 2147483648.0000000000000000 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 1.2000 |
| Supply Voltage-Max (V) | 1.45000 |
| Supply Voltage-Min (V) | 1.28300 |
| Supply Voltage-Nom (V) | 1.35 |
| Number of Words (words) | 268435456.0000000000000000 |
| Moisture Sensitivity Level | 3 |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature-Max (Cel) | 95.0 |
| Operating Temperature-Min (Cel) | 0.0 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200