MT40A512M16LY-062EIT:E

Micron Technology

MT40A512M16LY-062EIT:E

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Semiconductors

Memory ICs

Lead time 6 weeks
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks

DRAM Chip DDR4 SDRAM 8Gbit 512Mx16 1.2V 96-Pin FBGA Tray

Technical Data
I/O Type COMMON
Technology CMOS
Width (mm) 7.5000
Access Mode MULTI BANK PAGE BURST
Length (mm) 13.5000
JESD-30 Code R-PBGA-B96
Memory Width 16
Package Code TFBGA
Self Refresh YES
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
J-STD-609 Code e1
Memory IC Type DDR4 DRAM
Operating Mode SYNCHRONOUS
Refresh Cycles 65536
Reverse Pinout NO
Number of Ports 1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Additional Feature AUTO/SELF REFRESH
Memory Organization 512MX16
Number of Functions 1
Number of Terminals 96
Terminal Pitch (mm) 0.800
Number of Words Code 512M
Memory Density (bits) 8589934592.0000000000000000
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 1.26000
Supply Voltage-Min (V) 1.14000
Supply Voltage-Nom (V) 1.2
Number of Words (words) 536870912.0000000000000000
Interleaved Burst Length 8
Package Equivalence Code BGA96,9X16,32
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Operating Temperature-Max (Cel) 95.0
Operating Temperature-Min (Cel) -40.0
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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