MT40A512M16LY-062EIT:E
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DRAM Chip DDR4 SDRAM 8Gbit 512Mx16 1.2V 96-Pin FBGA Tray
I/O Type | COMMON |
Technology | CMOS |
Width (mm) | 7.5000 |
Access Mode | MULTI BANK PAGE BURST |
Length (mm) | 13.5000 |
JESD-30 Code | R-PBGA-B96 |
Memory Width | 16 |
Package Code | TFBGA |
Self Refresh | YES |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Surface Mount | YES |
Terminal Form | BALL |
J-STD-609 Code | e1 |
Memory IC Type | DDR4 DRAM |
Operating Mode | SYNCHRONOUS |
Refresh Cycles | 65536 |
Reverse Pinout | NO |
Number of Ports | 1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Additional Feature | AUTO/SELF REFRESH |
Memory Organization | 512MX16 |
Number of Functions | 1 |
Number of Terminals | 96 |
Terminal Pitch (mm) | 0.800 |
Number of Words Code | 512M |
Memory Density (bits) | 8589934592.0000000000000000 |
Package Body Material | PLASTIC/EPOXY |
Seated Height-Max (mm) | 1.2000 |
Supply Voltage-Max (V) | 1.26000 |
Supply Voltage-Min (V) | 1.14000 |
Supply Voltage-Nom (V) | 1.2 |
Number of Words (words) | 536870912.0000000000000000 |
Interleaved Burst Length | 8 |
Package Equivalence Code | BGA96,9X16,32 |
Moisture Sensitivity Level | 3 |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Operating Temperature-Max (Cel) | 95.0 |
Operating Temperature-Min (Cel) | -40.0 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200