MT40A256M16LY-062EIT:F

Micron Technology

MT40A256M16LY-062EIT:F

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Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks

DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA Tray

Technical Data
Width 7.5
Length 13.5
Technology CMOS
Access Mode DUAL BANK PAGE BURST
JESD-30 Code R-PBGA-B96
Memory Width 16
Organization 256MX16
Package Code TFBGA
Self Refresh YES
JESD-609 Code e1
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
Memory Density 4294967296
Memory IC Type DDR4 DRAM
Operating Mode SYNCHRONOUS
Terminal Pitch .8
Number of Ports 1
Number of Words 268435456
Terminal Finish TIN SILVER COPPER
Seated Height-Max 1.2
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Additional Feature AUTO/SELF REFRESH
Number of Functions 1
Number of Terminals 96
Number of Words Code 256M
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 95
Operating Temperature-Min -40
Supply Voltage-Max (Vsup) 1.26
Supply Voltage-Min (Vsup) 1.14
Supply Voltage-Nom (Vsup) 1.2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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