MT29F8G08ABACAWP-IT:C

Micron Technology

MT29F8G08ABACAWP-IT:C

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Design risk

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Lead time

Semiconductors

Memory ICs

Lead time 6 weeks
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks

SLC NAND Flash Parallel 3.3V 8G-bit 1G x 8 48-Pin TSOP-I Tray

Technical Data
Type SLC NAND TYPE
Ready/Busy YES
Technology CMOS
Toggle Bit NO
Width (mm) 12.0000
Length (mm) 18.4000
Data Polling NO
JESD-30 Code R-PDSO-G48
Memory Width 8
Package Code TSOP1
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Surface Mount YES
Terminal Form GULL WING
Memory IC Type EEPROM CARD
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL
Page Size (words) 4K
Temperature Grade INDUSTRIAL
Terminal Position DUAL
Memory Organization 1GX8
Number of Functions 1
Number of Terminals 48
Sector Size (words) 256K
Terminal Pitch (mm) 0.500
Number of Words Code 1G
Memory Density (bits) 8589934592.0000000000000000
Package Body Material PLASTIC/EPOXY
Command User Interface YES
Number of Sectors/Size 4K
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 2.70000
Supply Voltage-Nom (V) 3.3
Number of Words (words) 1073741824.0000000000000000
Programming Voltage (V) 2.7
Standby Current-Max (A) 0.000100000000000
Supply Current-Max (mA) 35.000000000000000
Package Equivalence Code TSSOP48,.8,20
Peak Reflow Temperature (Cel) NOT SPECIFIED
Operating Temperature-Max (Cel) 85.0
Operating Temperature-Min (Cel) -40.0
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215