MT29F4G08ABADAWP:D
Availability
Design risk
Price trend
Lead time
SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP-I Tray
Type | SLC NAND TYPE |
Technology | CMOS |
Width (mm) | 12.0000 |
Length (mm) | 18.4000 |
JESD-30 Code | R-PDSO-G48 |
Memory Width | 8 |
Package Code | TSOP1 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Surface Mount | YES |
Terminal Form | GULL WING |
J-STD-609 Code | e3 |
Memory IC Type | FLASH |
Operating Mode | ASYNCHRONOUS |
Parallel/Serial | SERIAL |
Terminal Finish | Matte Tin (Sn) |
Write Protection | HARDWARE |
DLA Qualification | Not Qualified |
Temperature Grade | COMMERCIAL |
Terminal Position | DUAL |
Memory Organization | 512MX8 |
Number of Functions | 1 |
Number of Terminals | 48 |
Terminal Pitch (mm) | 0.500 |
Number of Words Code | 512M |
Memory Density (bits) | 4294967296.0000000000000000 |
Package Body Material | PLASTIC/EPOXY |
Output Characteristics | 3-STATE |
Seated Height-Max (mm) | 1.2000 |
Supply Voltage-Max (V) | 3.60000 |
Supply Voltage-Min (V) | 2.70000 |
Supply Voltage-Nom (V) | 3.3 |
Data Retention Time-Min | 10 |
Number of Words (words) | 536870912.0000000000000000 |
Programming Voltage (V) | 3.3 |
Standby Current-Max (A) | 0.000100000000000 |
Supply Current-Max (mA) | 35.000000000000000 |
Package Equivalence Code | TSSOP48,.8,20 |
Peak Reflow Temperature (Cel) | 260 |
Endurance (Write/Erase Cycles) | 100000.000000000000000 |
Operating Temperature-Max (Cel) | 70.0 |
Operating Temperature-Min (Cel) | 0.0 |
Write Cycle Time-Max (tWC) (ms) | 0.0000200000000000 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Submit request
CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200