MT29F4G08ABADAWP:D

Micron Technology

MT29F4G08ABADAWP:D

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Semiconductors

Memory ICs

Lead time 6 weeks
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Availability

Design risk

Price trend

Lead time

Semiconductors

Memory ICs

Lead time 6 weeks

SLC NAND Flash Parallel 3.3V 4G-bit 512M x 8 48-Pin TSOP-I Tray

Technical Data
Type SLC NAND TYPE
Technology CMOS
Width (mm) 12.0000
Length (mm) 18.4000
JESD-30 Code R-PDSO-G48
Memory Width 8
Package Code TSOP1
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form GULL WING
J-STD-609 Code e3
Memory IC Type FLASH
Operating Mode ASYNCHRONOUS
Parallel/Serial SERIAL
Terminal Finish Matte Tin (Sn)
Write Protection HARDWARE
DLA Qualification Not Qualified
Temperature Grade COMMERCIAL
Terminal Position DUAL
Memory Organization 512MX8
Number of Functions 1
Number of Terminals 48
Terminal Pitch (mm) 0.500
Number of Words Code 512M
Memory Density (bits) 4294967296.0000000000000000
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 2.70000
Supply Voltage-Nom (V) 3.3
Data Retention Time-Min 10
Number of Words (words) 536870912.0000000000000000
Programming Voltage (V) 3.3
Standby Current-Max (A) 0.000100000000000
Supply Current-Max (mA) 35.000000000000000
Package Equivalence Code TSSOP48,.8,20
Peak Reflow Temperature (Cel) 260
Endurance (Write/Erase Cycles) 100000.000000000000000
Operating Temperature-Max (Cel) 70.0
Operating Temperature-Min (Cel) 0.0
Write Cycle Time-Max (tWC) (ms) 0.0000200000000000
Time@Peak Reflow Temperature-Max (s) 30

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