MAX77818EWZ+

Maxim Integrated

MAX77818EWZ+

Availability

Design risk

Price trend

Lead time

Semiconductors

Power Management Circuits

Lead time 6 weeks
Data sheet MAX77818EWZ+
3 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

Power Management Circuits

Lead time 6 weeks
Data sheet MAX77818EWZ+

Power Management Specialized - PMIC PMIC for smart phone

Technical Data
Width (mm) 3.608
Length (mm) 3.867
Technology BICMOS
JESD-30 Code R-PBGA-B72
Package Code VFBGA
JESD-609 Code e2
Package Shape RECTANGULAR
Package Style (Meter) GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
Terminal Pitch (mm) 0.4
Terminal Finish TIN SILVER COPPER NICKEL
Seated Height-Max (mm) 0.69
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Number of Channels 2
Number of Functions 1
Number of Terminals 72
Adjustable Threshold YES
Package Body Material PLASTIC/EPOXY
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40
Supply Voltage-Max (Vsup) (V) 5
Supply Voltage-Min (Vsup) (V) 2.8
Supply Voltage-Nom (Vsup) (V) 3.7
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215