WG82574ITSLBAC
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Ethernet CTLR Single Chip 10Mbps/100Mbps/1000Mbps 1.05V/1.9V/3.3V 64-Pin QFN EP Tray
| Speed (rpm) | 25 |
| Width (mm) | 9 |
| Length (mm) | 9 |
| Technology | CMOS |
| ADC Channels | NO |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-XQCC-N64 |
| PWM Channels | NO |
| Package Code | HVQCCN |
| Package Shape | SQUARE |
| Package Style (Meter) | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Surface Mount | YES |
| Terminal Form | NO LEAD |
| Terminal Pitch (mm) | 0.5 |
| Address Bus Width | 0 |
| Seated Height-Max (mm) | 1 |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | QUAD |
| Supply Voltage-Max (V) | 3.6 |
| Supply Voltage-Min (V) | 3 |
| Supply Voltage-Nom (V) | 3.3 |
| Clock Frequency-Max (MHz) | 25 |
| Number of Terminals | 64 |
| ROM Programmability | FLASH |
| Qualification Status | Not Qualified |
| Package Body Material | UNSPECIFIED |
| External Data Bus Width | 0 |
| Package Equivalence Code | LCC64,.35SQ,20 |
| Operating Temperature-Max (Cel) | 85 |
| Operating Temperature-Min (Cel) | -40 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200