PEX8619-BA50BIG
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PCI Express Switch 16Lanes 16 Port 324-Pin HSBGA
| Technology | CMOS |
| Width (mm) | 19 |
| Length (mm) | 19 |
| JESD-30 Code | S-PBGA-B324 |
| Package Code | HBGA |
| Package Shape | SQUARE |
| Package Style (Meter) | GRID ARRAY, HEAT SINK/SLUG |
| Surface Mount | YES |
| Terminal Form | BALL |
| J-STD-609 Code | e1 |
| Terminal Finish | TIN SILVER COPPER |
| Address Bus Width | 0 |
| Bus Compatibility | I2C; PCI; SMBUS; SPI; USB |
| DLA Qualification | Not Qualified |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Number of Terminals | 324 |
| Terminal Pitch (mm) | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 1.9 |
| Supply Voltage-Max (V) | 1.05 |
| Supply Voltage-Min (V) | 0.95 |
| Supply Voltage-Nom (V) | 1 |
| External Data Bus Width | 0 |
| Drive Interface Standard | IEEE 1149.1; IEEE 1149.6 |
| Package Equivalence Code | BGA324,18X18,40 |
| Clock Frequency-Max (MHz) | 100 |
| Moisture Sensitivity Level | 3 |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Data Transfer Rate-Max (MBps) | 0.0125 |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature-Max (Cel) | 85 |
| Operating Temperature-Min (Cel) | -40 |
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Sourceability North America, LLC
9715 Burnet Rd, Ste 200