XCF16PVOG48C

Xilinx,Inc.

XCF16PVOG48C

Availability

Design risk

Price trend

Lead time

Semiconductors

EEPROMs

Lead time 6 weeks
Data sheet XCF16PVOG48C
1 results found

Availability

Design risk

Price trend

Lead time

Semiconductors

EEPROMs

Lead time 6 weeks
Data sheet XCF16PVOG48C

FPGA - Configuration Memory Flash 16Mb PROM (ST Micro), Lead Free

Technical Data
Type NOR TYPE
Width (mm) 12
Length (mm) 18.45
Endurance (Write/Erase Cycles) 20000
Technology CMOS
JESD-30 Code R-PDSO-G48
Memory Width 1
Organization 16MX1
Package Code TSSOP
JESD-609 Code e3
Package Shape RECTANGULAR
Package Style (Meter) SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Surface Mount YES
Terminal Form GULL WING
Memory Density (bit) 16777216
Memory IC Type CONFIGURATION MEMORY
Operating Mode SYNCHRONOUS
Terminal Pitch (mm) 0.5
Number of Words (words) 16777216
Parallel/Serial SERIAL
Terminal Finish Matte Tin (Sn)
Seated Height-Max (mm) 1.2
Temperature Grade INDUSTRIAL
Terminal Position DUAL
Additional Feature IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
Supply Current-Max (mA) 40
Number of Functions 1
Number of Terminals 48
Number of Words Code 16M
Qualification Status Not Qualified
Package Body Material PLASTIC/EPOXY
Data Retention Time-Min 20
Package Equivalence Code TSSOP48,.8,20
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40
Supply Voltage-Max (Vsup) (V) 2
Supply Voltage-Min (Vsup) (V) 1.65
Supply Voltage-Nom (Vsup) (V) 1.8
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Submit request

CONTACT REASON

Connect with us

Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215