XCF04SVOG20C

Xilinx,Inc.

XCF04SVOG20C

Availability

Design risk

Price trend

Lead time

Semiconductors

EEPROMs

Lead time 6 weeks
Data sheet XCF04SVOG20C
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Availability

Design risk

Price trend

Lead time

Semiconductors

EEPROMs

Lead time 6 weeks
Data sheet XCF04SVOG20C

FPGA - Configuration Memory Flash 4Mb PROM (ST Micro)

Technical Data
Type NOR TYPE
Width (mm) 4.4
Length (mm) 6.5024
Endurance (Write/Erase Cycles) 20000
Technology CMOS
JESD-30 Code R-PDSO-G20
Memory Width 1
Organization 4MX1
Package Code TSSOP
JESD-609 Code e3
Package Shape RECTANGULAR
Package Style (Meter) SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Surface Mount YES
Terminal Form GULL WING
Memory Density (bit) 4194304
Memory IC Type CONFIGURATION MEMORY
Operating Mode SYNCHRONOUS
Terminal Pitch (mm) 0.65
Number of Words (words) 4194304
Parallel/Serial SERIAL
Terminal Finish Matte Tin (Sn)
Write Protection HARDWARE
Seated Height-Max (mm) 1.19
Terminal Position DUAL
Supply Current-Max (mA) 10
Number of Functions 1
Number of Terminals 20
Programming Voltage (V) 3.3
Standby Current-Max (Amp) 0.01
Number of Words Code 4M
Qualification Status Not Qualified
Package Body Material PLASTIC/EPOXY
Data Retention Time-Min 20
Package Equivalence Code TSSOP20,.25
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40
Supply Voltage-Max (Vsup) (V) 3.6
Supply Voltage-Min (Vsup) (V) 3
Supply Voltage-Nom (Vsup) (V) 3.3
Clock Frequency-Max (fCLK) (MHz) 33
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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