XCF04SVOG20C
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FPGA - Configuration Memory Flash 4Mb PROM (ST Micro)
Type | NOR TYPE |
Width (mm) | 4.4 |
Length (mm) | 6.5024 |
Endurance (Write/Erase Cycles) | 20000 |
Technology | CMOS |
JESD-30 Code | R-PDSO-G20 |
Memory Width | 1 |
Organization | 4MX1 |
Package Code | TSSOP |
JESD-609 Code | e3 |
Package Shape | RECTANGULAR |
Package Style (Meter) | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Surface Mount | YES |
Terminal Form | GULL WING |
Memory Density (bit) | 4194304 |
Memory IC Type | CONFIGURATION MEMORY |
Operating Mode | SYNCHRONOUS |
Terminal Pitch (mm) | 0.65 |
Number of Words (words) | 4194304 |
Parallel/Serial | SERIAL |
Terminal Finish | Matte Tin (Sn) |
Write Protection | HARDWARE |
Seated Height-Max (mm) | 1.19 |
Terminal Position | DUAL |
Supply Current-Max (mA) | 10 |
Number of Functions | 1 |
Number of Terminals | 20 |
Programming Voltage (V) | 3.3 |
Standby Current-Max (Amp) | 0.01 |
Number of Words Code | 4M |
Qualification Status | Not Qualified |
Package Body Material | PLASTIC/EPOXY |
Data Retention Time-Min | 20 |
Package Equivalence Code | TSSOP20,.25 |
Operating Temperature-Max (Cel) | 85 |
Operating Temperature-Min (Cel) | -40 |
Supply Voltage-Max (Vsup) (V) | 3.6 |
Supply Voltage-Min (Vsup) (V) | 3 |
Supply Voltage-Nom (Vsup) (V) | 3.3 |
Clock Frequency-Max (fCLK) (MHz) | 33 |
Moisture Sensitivity Level | 3 |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
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CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200