SDINBDG4-64G-XI1
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MLC NAND Flash Serial e-MMC 3.3V 512G-bit 153-Pin BGA
| Type | MLC NAND TYPE |
| Technology | CMOS |
| Width (mm) | 11.5 |
| Length (mm) | 13 |
| JESD-30 Code | R-PBGA-B153 |
| Memory Width | 8 |
| Package Code | TFBGA |
| Package Shape | RECTANGULAR |
| Package Style (Meter) | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Surface Mount | YES |
| Terminal Form | BALL |
| Memory IC Type | Embedded MMC |
| Operating Mode | SYNCHRONOUS |
| Parallel/Serial | SERIAL |
| Serial Bus Type | EMMC 5.1 |
| Terminal Position | BOTTOM |
| Memory Organization | 64GX8 |
| Number of Functions | 1 |
| Number of Terminals | 153 |
| Terminal Pitch (mm) | 0.5 |
| Number of Words Code | 64G |
| Memory Density (bits) | 549755813888 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 1.2 |
| Supply Voltage-Max (V) | 3.6 |
| Supply Voltage-Min (V) | 2.7 |
| Supply Voltage-Nom (V) | 3.3 |
| Data Retention Time-Min | 1 |
| Number of Words (words) | 68719476736 |
| Programming Voltage (V) | 3.3 |
| Package Equivalence Code | BGA153,14X14,20 |
| Clock Frequency-Max (MHz) | 200 |
| Endurance (Write/Erase Cycles) | 3000 |
| Operating Temperature-Max (Cel) | 85 |
| Operating Temperature-Min (Cel) | -40 |
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CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200You can download the user manual and technical specifications for Western Digital Corporation SDINBDG4-64G-XI1 in the documentation section.
MLC NAND Flash Serial e-MMC 3.3V 512G-bit 153-Pin BGA
As part of the category Semiconductors and subcategory Semiconductors, SDINBDG4-64G-XI1 optimizes energy distribution in electronic devices. Its MLC NAND Flash Serial e-MMC 3.3V 512G-bit 153-Pin BGA allows minimizing losses and increasing the overall system efficiency.
As a component of the subcategory Semiconductors, SDINBDG4-64G-XI1 ensures stable output voltage even when the load changes. Its MLC NAND Flash Serial e-MMC 3.3V 512G-bit 153-Pin BGA makes it a reliable element in multi-level power systems.
