THGBMUG6C1LBAIL

KIOXIA HOLDINGS CORP

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THGBMUG6C1LBAIL

THGBMUG6C1LBAIL

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Semiconductors

Memory ICs

Lead Time     53 weeks
Data Sheet     Download THGBMUG6C1LBAIL datasheet THGBMUG6C1LBAIL

NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin WFBGA Tray

Technical Data

Manufacturer kioxia holdings corp
MPN THGBMUG6C1LBAIL
Type 3D NAND
Technology CMOS
Width (mm) 11.5000
Length (mm) 13.0000
JESD-30 Code R-PBGA-B153
Memory Width 8.0000
Package Code VFBGA
Package Shape RECTANGULAR
Package Style ( Meter ) GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
Memory IC Type Embedded MMC
Operating Mode ASYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type EMMC 5.1
Terminal Position BOTTOM
Memory Organization 8GX8
Number of Functions 1.0000
Number of Terminals 153.0000
Terminal Pitch (mm) 0.5000
Number of Words Code 8G
Memory Density (bits) 68719476736.0000
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 0.8000
Supply Voltage-Max (V) 3.6000
Supply Voltage-Min (V) 2.7000
Supply Voltage-Nom (V) 3.3000
Number of Words (words) 8589934592.0000
Programming Voltage (V) 3.3000
Package Equivalence Code BGA153,14X14,20
Operating Temperature-Max (Cel) 85.0000
Operating Temperature-Min (Cel) -25.0000
Availability In stock

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HEADQUARTERS

Sourceability North America, LLC

9715 Burnet Rd, Ste 200 Austin, TX 78758-5215

Frequently Asked Questions

As part of the category Semiconductors and subcategory Memory ICs, THGBMUG6C1LBAIL optimizes energy distribution in electronic devices. Its NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin WFBGA Tray allows minimizing losses and increasing the overall system efficiency.

As a component of the subcategory Memory ICs, THGBMUG6C1LBAIL ensures stable output voltage even when the load changes. Its makes it a reliable element in multi-level power systems.

You can download the user manual and technical specifications for THGBMUG6C1LBAIL in the documentation section.

NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin WFBGA Tray