THGBMUG6C1LBAIL
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NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin WFBGA Tray
| Type | 3D NAND |
| Technology | CMOS |
| Width (mm) | 11.5 |
| Length (mm) | 13 |
| JESD-30 Code | R-PBGA-B153 |
| Memory Width | 8 |
| Package Code | VFBGA |
| Package Shape | RECTANGULAR |
| Package Style (Meter) | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Surface Mount | YES |
| Terminal Form | BALL |
| Memory IC Type | Embedded MMC |
| Operating Mode | ASYNCHRONOUS |
| Parallel/Serial | SERIAL |
| Serial Bus Type | EMMC 5.1 |
| Terminal Position | BOTTOM |
| Memory Organization | 8GX8 |
| Number of Functions | 1 |
| Number of Terminals | 153 |
| Terminal Pitch (mm) | 0.5 |
| Number of Words Code | 8G |
| Memory Density (bits) | 68719476736 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 0.8 |
| Supply Voltage-Max (V) | 3.6 |
| Supply Voltage-Min (V) | 2.7 |
| Supply Voltage-Nom (V) | 3.3 |
| Number of Words (words) | 8589934592 |
| Programming Voltage (V) | 3.3 |
| Package Equivalence Code | BGA153,14X14,20 |
| Operating Temperature-Max (Cel) | 85 |
| Operating Temperature-Min (Cel) | -25 |
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CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200You can download the user manual and technical specifications for KIOXIA Holdings Corporation THGBMUG6C1LBAIL in the documentation section.
NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin WFBGA Tray
As part of the category Semiconductors and subcategory Semiconductors, THGBMUG6C1LBAIL optimizes energy distribution in electronic devices. Its NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin WFBGA Tray allows minimizing losses and increasing the overall system efficiency.
As a component of the subcategory Semiconductors, THGBMUG6C1LBAIL ensures stable output voltage even when the load changes. Its NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin WFBGA Tray makes it a reliable element in multi-level power systems.
