THGBMJG6C1LBAU7

KIOXIA Holdings Corporation

THGBMJG6C1LBAU7

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Semiconductors

Memory ICs

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Semiconductors

Memory ICs

Lead time 11 weeks

MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100

Technical Data
Type MLC NAND TYPE
Technology CMOS
Width (mm) 11.5000
Length (mm) 13.0000
JESD-30 Code R-PBGA-B153
Memory Width 8
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
Memory IC Type Embedded MMC
Operating Mode ASYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type EMMC 5.1
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Memory Organization 8GX8
Number of Functions 1
Number of Terminals 153
Terminal Pitch (mm) 0.500
Number of Words Code 8G
Memory Density (bits) 68719476736.0000000000000000
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 3.60000
Supply Voltage-Min (V) 2.70000
Supply Voltage-Nom (V) 3.3
Number of Words (words) 8589934592.0000000000000000
Programming Voltage (V) 3.3
Supply Current-Max (mA) 40.000000000000000
Package Equivalence Code BGA153,14X14,20
Clock Frequency-Max (MHz) 52.00000
Operating Temperature-Max (Cel) 105.0
Operating Temperature-Min (Cel) -40.0
Screening Level / Reference Standard AEC-Q100

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Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215

Frequently Asked Questions

What documentation is available for KIOXIA Holdings Corporation THGBMJG6C1LBAU7?

You can download the user manual and technical specifications for KIOXIA Holdings Corporation THGBMJG6C1LBAU7 in the documentation section.

What are the key features of KIOXIA Holdings Corporation THGBMJG6C1LBAU7?

MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100

How does KIOXIA Holdings Corporation THGBMJG6C1LBAU7 contribute to energy efficiency?

As part of the category Semiconductors and subcategory Semiconductors, THGBMJG6C1LBAU7 optimizes energy distribution in electronic devices. Its MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100 allows minimizing losses and increasing the overall system efficiency.

Why is THGBMJG6C1LBAU7 suitable for complex power management systems?

As a component of the subcategory Semiconductors, THGBMJG6C1LBAU7 ensures stable output voltage even when the load changes. Its MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100 makes it a reliable element in multi-level power systems.