H5ANAG6NCJR-XNC SK HYNIX INC

H5ANAG6NCJR-XNC SK HYNIX INC
Availability
Available
H5ANAG6NCJR-XNC Availability: In Stock
Design risk
High
Design risk
Price trend
Stable
Price trend
Lead time
Stable
Lead time
15 results found
NR301E
NR301E Availability: In Stock
Available
High
High
Decreasing
Decreasing
Stable
Stable
EPC2036
EPC2036 Availability: In Stock
Available
Medium
Medium
Decreasing
Decreasing
Stable
Stable
THVD2410DR
THVD2410DR Availability: In Stock
Available
High
High
Increasing
Increasing
Stable
Stable
14235R-2000
14235R-2000 Availability: In Stock
Available
High
High
Stable
Stable
Increasing
Increasing
TL431AIDBZR
TL431AIDBZR Availability: Out of Stock
Unavailable
Low
Low
Increasing
Increasing
Stable
Stable
TLC2274AIDR
TLC2274AIDR Availability: Out of Stock
Constrained
Low
Low
Increasing
Increasing
Stable
Stable
BAS40-05,215
BAS40-05,215 Availability: Out of Stock
Unavailable
Low
Low
Decreasing
Decreasing
Increasing
Increasing
MAX3072EESA+
MAX3072EESA+ Availability: In Stock
Available
Medium
Medium
Decreasing
Decreasing
Increasing
Increasing
TPS54418RTER
TPS54418RTER Availability: Out of Stock
Constrained
Low
Low
Increasing
Increasing
Stable
Stable
0402B103K160CT
0402B103K160CT Availability: Out of Stock
Constrained
Low
Low
Decreasing
Decreasing
Stable
Stable
0805B105K250CT
0805B105K250CT Availability: Out of Stock
Constrained
Low
Low
Stable
Stable
Stable
Stable
LM5117PMHX/NOPB
LM5117PMHX/NOPB Availability: Out of Stock
Constrained
Low
Low
Increasing
Increasing
Stable
Stable
MX25U12832FM2I0...
MX25U12832FM2I02 Availability: In Stock
Available
High
High
Decreasing
Decreasing
Increasing
Increasing
XC7Z020-1CLG400...
XC7Z020-1CLG400I Availability: In Stock
Available
High
High
Stable
Stable
Increasing
Increasing
TCC0805X7R224K5...
TCC0805X7R224K500DT Availability: In Stock
Available
High
High
Stable
Stable
Stable
Stable

Semiconductors

Memory ICs

Lead Time     2 weeks

Datasheet

    Download H5ANAG6NCJR-XNC datasheet H5ANAG6NCJR-XNC

DRAM Chip DDR4 SDRAM 16Gbit 1Gx16 1.2V 96-Pin FBGA

Technical Data

Manufacturer sk hynix inc
MPN H5ANAG6NCJR-XNC
I/O Type COMMON
Technology CMOS
Width (mm) 8.0000
Access Mode MULTI BANK PAGE BURST
Length (mm) 13.0000
JESD-30 Code R-PBGA-B96
Memory Width 16.0000
Self Refresh YES
Package Shape RECTANGULAR
Surface Mount YES
Terminal Form BALL
Memory IC Type DDR4 DRAM
Operating Mode SYNCHRONOUS
Number of Ports 1.0000
Terminal Position BOTTOM
Additional Feature AUTO/SELF REFRESH
Memory Organization 1GX16
Number of Functions 1.0000
Number of Terminals 96.0000
Terminal Pitch (mm) 0.8000
Number of Words Code 1G
Memory Density (bits) 17179869184.0000
Package Body Material PLASTIC/EPOXY
Supply Voltage-Max (V) 1.2600
Supply Voltage-Min (V) 1.1400
Supply Voltage-Nom (V) 1.2000
Number of Words (words) 1073741824.0000
Sequential Burst Length 4,8
Standby Current-Max (A) 0.0740
Supply Current-Max (mA) 74.0000
Interleaved Burst Length 4,8
Package Equivalence Code BGA96,9X16,32
Clock Frequency-Max (MHz) 1600.0000
Operating Temperature-Max (Cel) 85.0000
Operating Temperature-Min (Cel) 0.0000
Availability In stock

Submit Request

CONTACT REASON

Connect With Us

HEADQUARTERS

Sourceability North America, LLC

9715 Burnet Rd, Ste 200 Austin, TX 78758-5215

FOR GENERAL INQUIRES

Email [email protected]

Phone +1-888-952-9225

Frequently Asked Questions

As part of the category Semiconductors and subcategory Memory ICs, H5ANAG6NCJR-XNC optimizes energy distribution in electronic devices. Its DRAM Chip DDR4 SDRAM 16Gbit 1Gx16 1.2V 96-Pin FBGA allows minimizing losses and increasing the overall system efficiency.

As a component of the subcategory Memory ICs, H5ANAG6NCJR-XNC ensures stable output voltage even when the load changes. Its makes it a reliable element in multi-level power systems.

You can download the user manual and technical specifications for H5ANAG6NCJR-XNC in the documentation section.

DRAM Chip DDR4 SDRAM 16Gbit 1Gx16 1.2V 96-Pin FBGA

S34ML08G101TFI000