BGM113A256V2 SILICON LABORATORIES INC

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Semiconductors

RF/Microwave Devices

Lead Time     12 weeks
Data Sheet     Download BGM113A256V2 datasheet BGM113A256V2

BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna

Technical Data

Manufacturer silicon laboratories inc
MPN BGM113A256V2
Width (mm) 9.1500
Length (mm) 15.7300
JESD-30 Code R-XXMA-N36
Package Code XMA
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Surface Mount YES
Terminal Form NO LEAD
Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Position UNSPECIFIED
Number of Functions 1.0000
Number of Terminals 36.0000
Terminal Pitch (mm) 0.8000
Package Body Material UNSPECIFIED
Seated Height-Max (mm) 2.0000
Supply Voltage-Nom (V) 3.3000
Operating Temperature-Max (Cel) 85.0000
Operating Temperature-Min (Cel) -40.0000
Availability In stock

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CONTACT REASON

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HEADQUARTERS

Sourceability North America, LLC

9715 Burnet Rd, Ste 200 Austin, TX 78758-5215

FOR GENERAL INQUIRES

Email [email protected]

Phone +1-888-952-9225

Frequently Asked Questions

As part of the category Semiconductors and subcategory RF/Microwave Devices, BGM113A256V2 optimizes energy distribution in electronic devices. Its BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna allows minimizing losses and increasing the overall system efficiency.

As a component of the subcategory RF/Microwave Devices, BGM113A256V2 ensures stable output voltage even when the load changes. Its makes it a reliable element in multi-level power systems.

You can download the user manual and technical specifications for BGM113A256V2 in the documentation section.

BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna

M1F60-6063