BGM113A256V2
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BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna
| Width (mm) | 9.1500 |
| Length (mm) | 15.7300 |
| JESD-30 Code | R-XXMA-N36 |
| Package Code | XMA |
| Package Shape | RECTANGULAR |
| Package Style | MICROELECTRONIC ASSEMBLY |
| Surface Mount | YES |
| Terminal Form | NO LEAD |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | UNSPECIFIED |
| Number of Functions | 1 |
| Number of Terminals | 36 |
| Terminal Pitch (mm) | 0.800 |
| Package Body Material | UNSPECIFIED |
| Seated Height-Max (mm) | 2.0000 |
| Supply Voltage-Nom (V) | 3.3000000000000000 |
| Operating Temperature-Max (Cel) | 85 |
| Operating Temperature-Min (Cel) | -40 |
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CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200You can download the user manual and technical specifications for Silicon Laboratories, Inc. BGM113A256V2 in the documentation section.
BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna
As part of the category Semiconductors and subcategory Semiconductors, BGM113A256V2 optimizes energy distribution in electronic devices. Its BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna allows minimizing losses and increasing the overall system efficiency.
As a component of the subcategory Semiconductors, BGM113A256V2 ensures stable output voltage even when the load changes. Its BGM113 module with 2.4 GHz SoC and a high-efficiency chip antenna makes it a reliable element in multi-level power systems.
