What documentation is available for EVERSPIN TECHNOLOGIES INC MR25H10CDF?

You can download the user manual and technical specifications for EVERSPIN TECHNOLOGIES INC MR25H10CDF in the documentation section.

MR25H10CDF EVERSPIN TECHNOLOGIES INC

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Semiconductors

Lead Time 26 weeks

Datasheet

MR25H10CDF

MRAM 1Mbit Serial-SPI Interface 3.3V 8-Pin DFN EP Tray

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Technical Data

Manufacturer everspin technologies inc

MPN MR25H10CDF

Technology CMOS

Width (mm) 5.0000

Length (mm) 6.0000

JESD-30 Code R-PDSO-N8

Memory Width 8.0000

Package Code HVSON

Package Shape RECTANGULAR

Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Surface Mount YES

Terminal Form NO LEAD

J-STD-609 Code e3

Memory IC Type MRAM

Operating Mode SYNCHRONOUS

Parallel/Serial SERIAL

Serial Bus Type SPI

Terminal Finish Matte Tin (Sn)

Write Protection HARDWARE/SOFTWARE

DLA Qualification Not Qualified

Temperature Grade INDUSTRIAL

Terminal Position DUAL

Memory Organization 128KX8

Number of Functions 1.0000

Number of Terminals 8.0000

Terminal Pitch (mm) 1.2700

Number of Words Code 128K

Memory Density (bits) 1048576.0000

Package Body Material PLASTIC/EPOXY

Seated Height-Max (mm) 0.9000

Supply Voltage-Max (V) 3.6000

Supply Voltage-Min (V) 2.7000

Supply Voltage-Nom (V) 3.3000

Number of Words (words) 131072.0000

Standby Current-Max (A) 0.0001

Standby Voltage-Min (V) 2.7000

Supply Current-Max (mA) 27.0000

Package Equivalence Code SOLCC8,.25

Clock Frequency-Max (MHz) 40.0000

Moisture Sensitivity Level 3.0000

Peak Reflow Temperature (Cel) 260.0000

Operating Temperature-Max (Cel) 85.0000

Operating Temperature-Min (Cel) -40.0000

Time@Peak Reflow Temperature-Max (s) 30.0000

Availability In stock

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HEADQUARTERS

Sourceability North America, LLC

9715 Burnet Rd, Ste 200 Austin, TX 78758-5215

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Email [email protected]

+1-888-952-9225

Frequently Asked Questions

How does MR25H10CDF contribute to energy efficiency?

As part of the category Semiconductors and subcategory Semiconductors, MR25H10CDF optimizes energy distribution in electronic devices. Its MRAM 1Mbit Serial-SPI Interface 3.3V 8-Pin DFN EP Tray allows minimizing losses and increasing the overall system efficiency.

Why is MR25H10CDF suitable for complex power management systems?

As a component of the subcategory Semiconductors, MR25H10CDF ensures stable output voltage even when the load changes. Its makes it a reliable element in multi-level power systems.

What documentation is available for MR25H10CDF?

You can download the user manual and technical specifications for MR25H10CDF in the documentation section.

What are the key features of MR25H10CDF?

MRAM 1Mbit Serial-SPI Interface 3.3V 8-Pin DFN EP Tray

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