THGBMJG6C1LBAU7

KIOXIA HOLDINGS CORP

THGBMJG6C1LBAU7
 
THGBMJG6C1LBAU7

THGBMJG6C1LBAU7

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Available
Availability
Design risk
High
Design risk
Price trend
Stable
Price trend
Lead time
Increasing
Lead time
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Semiconductors

Semiconductors

Lead Time     53 weeks
Data Sheet     Download THGBMJG6C1LBAU7 datasheet THGBMJG6C1LBAU7

MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100

Technical Data

Manufacturer KIOXIA HOLDINGS CORP
MPN THGBMJG6C1LBAU7
Type MLC NAND TYPE
Technology CMOS
Width (mm) 11.5000
Length (mm) 13.0000
JESD-30 Code R-PBGA-B153
Memory Width 8.0000
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
Memory IC Type Embedded MMC
Operating Mode ASYNCHRONOUS
Parallel/Serial SERIAL
Serial Bus Type EMMC 5.1
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Memory Organization 8GX8
Number of Functions 1.0000
Number of Terminals 153.0000
Terminal Pitch (mm) 0.5000
Number of Words Code 8G
Memory Density (bits) 68719476736.0000
Package Body Material PLASTIC/EPOXY
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 3.6000
Supply Voltage-Min (V) 2.7000
Supply Voltage-Nom (V) 3.3000
Number of Words (words) 8589934592.0000
Programming Voltage (V) 3.3000
Supply Current-Max (mA) 40.0000
Package Equivalence Code BGA153,14X14,20
Clock Frequency-Max (MHz) 52.0000
Operating Temperature-Max (Cel) 105.0000
Operating Temperature-Min (Cel) -40.0000
Screening Level / Reference Standard AEC-Q100
Availability In stock

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CONTACT REASON

Connect With Us

HEADQUARTERS

Sourceability North America, LLC

9715 Burnet Rd, Ste 200 Austin, TX 78758-5215

FOR GENERAL INQUIRES

Email [email protected]

Phone +1-888-952-9225

Frequently Asked Questions

As part of the category Semiconductors and subcategory Semiconductors, THGBMJG6C1LBAU7 optimizes energy distribution in electronic devices. Its MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100 allows minimizing losses and increasing the overall system efficiency.

As a component of the subcategory Semiconductors, THGBMJG6C1LBAU7 ensures stable output voltage even when the load changes. Its makes it a reliable element in multi-level power systems.

You can download the user manual and technical specifications for THGBMJG6C1LBAU7 in the documentation section.

MLC NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/2-bit/4-bit 153-Pin VFBGA Tray Automotive AEC-Q100