EPCQ64ASI16N

Intel Corporation

EPCQ64ASI16N

Availability

Design risk

Price trend

Lead time

Semiconductors

PROMs

15 results found

Availability

Design risk

Price trend

Lead time

Unavailable
Low
Decrease
Stable
DB106-BP (MICROCOMMERCIALCOMPONENTS)
View Details
Available
High
Stable
Stable
FF300R12ME4 (INFINEONTECHNOLOGIESAG)
View Details
Unavailable
Low
Stable
Stable
TCA9517DGKR (TEXASINSTRUMENTSINC)
View Details
Unavailable
Low
Increase
Increase
TMP100NA/3K (TEXASINSTRUMENTSINC)
View Details
Unavailable
High
Stable
Stable
INA105KU/2K5 (TEXASINSTRUMENTSINC)
View Details
Unavailable
Low
Increase
Stable
TMP102AIDRLR (TEXASINSTRUMENTSINC)
View Details
Constrained
Low
Increase
Stable
TPS25810RVCR (TEXASINSTRUMENTSINC)
View Details
Available
Medium
Decrease
Stable
DMR-01-T-V-T/R (DIPTRONICSMANUFACTURINGINC)
View Details
Available
Low
Decrease
Stable
PESD5V0C1USFYL (NEXPERIA)
View Details
Unavailable
Low
Decrease
Stable
RMC1/16-271JTP (KAMAYAELECTRICCOLTD)
View Details
Available
High
Stable
Stable
C43Q1472M40C000 (XIAMENFARATRONICCOLTD)
View Details
Available
High
Increase
Stable
MAX16926GTP/V+T (ANALOGDEVICESINC)
View Details
Available
Low
Increase
Stable
IHLP4040DZER3R3M01 (VISHAYINTERTECHNOLOGYINC)
View Details
Constrained
High
Stable
Stable
XC3S1200E-4FGG320I (ADVANCEDMICRODEVICESINC)
View Details
Available
Low
Decrease
Stable
DF40HC(4.0)-60DS-0.4V(51) (HIROSEELECTRICCOLTD)
View Details

Semiconductors

PROMs

Lead time 16 weeks
Data sheet EPCQ64ASI16N

FPGA Configuration Flash Memory

Technical Data
Type NOR TYPE
Technology CMOS
Width (mm) 7.5
Length (mm) 10.3
JESD-30 Code R-PDSO-G16
Memory Width 8
Package Code SOP
Package Shape RECTANGULAR
Package Style (Meter) SMALL OUTLINE
Surface Mount YES
Terminal Form GULL WING
J-STD-609 Code e3
Memory IC Type CONFIGURATION MEMORY
Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL
Terminal Finish Matte Tin (Sn) - annealed
Temperature Grade INDUSTRIAL
Terminal Position DUAL
Memory Organization 8MX8
Number of Functions 1
Number of Terminals 16
Terminal Pitch (mm) 1.27
Number of Words Code 8M
Memory Density (bits) 67108864
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 2.65
Supply Voltage-Max (V) 3.6
Supply Voltage-Min (V) 2.7
Supply Voltage-Nom (V) 3.3
Data Retention Time-Min 20
Number of Words (words) 8388608
Programming Voltage (V) 3.3
Standby Current-Max (A) 5.0E-5
Supply Current-Max (mA) 15
Package Equivalence Code SOP16,.4
Clock Frequency-Max (MHz) 100
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Operating Temperature-Max (Cel) 85
Operating Temperature-Min (Cel) -40
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Submit request

CONTACT REASON

Connect with us

Sourceability North America, LLC

9715 Burnet Rd, Ste 200
Austin, TX 78758-5215

Frequently Asked Questions

What documentation is available for Intel Corporation EPCQ64ASI16N?

You can download the user manual and technical specifications for Intel Corporation EPCQ64ASI16N in the documentation section.

What are the key features of Intel Corporation EPCQ64ASI16N?

FPGA Configuration Flash Memory

How does Intel Corporation EPCQ64ASI16N contribute to energy efficiency?

As part of the category Semiconductors and subcategory Semiconductors, EPCQ64ASI16N optimizes energy distribution in electronic devices. Its FPGA Configuration Flash Memory allows minimizing losses and increasing the overall system efficiency.

Why is EPCQ64ASI16N suitable for complex power management systems?

As a component of the subcategory Semiconductors, EPCQ64ASI16N ensures stable output voltage even when the load changes. Its FPGA Configuration Flash Memory makes it a reliable element in multi-level power systems.