EPCQ64ASI16N

INTEL CORP

EPCQ64ASI16N
 
EPCQ64ASI16N

EPCQ64ASI16N

Availability
Available
Availability
Design risk
High
Design risk
Price trend
Stable
Price trend
Lead time
Stable
Lead time
15 results found
FDN5618P
Available
Available
Low
Low
Increasing
Increasing
Increasing
Increasing
BC817-40Q
Unavailable
Unavailable
Low
Low
Decreasing
Decreasing
Stable
Stable
LD1-100-R
Available
Available
Low
Low
Decreasing
Decreasing
Increasing
Increasing
US1J-E3/61T
Unavailable
Unavailable
Low
Low
Decreasing
Decreasing
Increasing
Increasing
CR1632FH1-LF
Constrained
Constrained
Low
Low
Stable
Stable
Stable
Stable
WR06X2401FGL
Unavailable
Unavailable
Low
Low
Stable
Stable
Stable
Stable
C8051F340-GQR
Constrained
Constrained
High
High
Stable
Stable
Stable
Stable
MP2451DJ-LF-Z
Available
Available
Low
Low
Decreasing
Decreasing
Stable
Stable
RT9073A-19GQZ
Available
Available
High
High
Decreasing
Decreasing
Stable
Stable
0402B102K500CT
Constrained
Constrained
Low
Low
Decreasing
Decreasing
Decreasing
Decreasing
0805N681J501CT
Constrained
Constrained
Medium
Medium
Stable
Stable
Stable
Stable
1206N470J102CT
Available
Available
High
High
Decreasing
Decreasing
Decreasing
Decreasing
XC6SLX9-2TQG144...
Constrained
Constrained
High
High
Stable
Stable
Stable
Stable
AT45DB641E-SHN2...
Available
Available
High
High
Decreasing
Decreasing
Decreasing
Decreasing
XC4VFX60-10FFG6...
Unavailable
Unavailable
High
High
Stable
Stable
Stable
Stable

Semiconductors

Memory ICs

Lead Time     2 weeks
Data Sheet     Download EPCQ64ASI16N datasheet EPCQ64ASI16N

FPGA Configuration Flash Memory

Technical Data

Manufacturer intel corp
MPN EPCQ64ASI16N
Type NOR TYPE
Technology CMOS
Width (mm) 7.5000
Length (mm) 10.3000
JESD-30 Code R-PDSO-G16
Memory Width 8.0000
Package Code SOP
Package Shape RECTANGULAR
Package Style ( Meter ) SMALL OUTLINE
Surface Mount YES
Terminal Form GULL WING
J-STD-609 Code e3
Memory IC Type CONFIGURATION MEMORY
Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL
Terminal Finish Matte Tin (Sn) - annealed
Temperature Grade INDUSTRIAL
Terminal Position DUAL
Memory Organization 8MX8
Number of Functions 1.0000
Number of Terminals 16.0000
Terminal Pitch (mm) 1.2700
Number of Words Code 8M
Memory Density (bits) 67108864.0000
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 2.6500
Supply Voltage-Max (V) 3.6000
Supply Voltage-Min (V) 2.7000
Supply Voltage-Nom (V) 3.3000
Data Retention Time-Min 20.0000
Number of Words (words) 8388608.0000
Programming Voltage (V) 3.3000
Standby Current-Max (A) 0.0001
Supply Current-Max (mA) 15.0000
Package Equivalence Code SOP16,.4
Clock Frequency-Max (MHz) 100.0000
Moisture Sensitivity Level 3.0000
Peak Reflow Temperature (Cel) NOT SPECIFIED
Operating Temperature-Max (Cel) 85.0000
Operating Temperature-Min (Cel) -40.0000
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Availability In stock

Submit Request

CONTACT REASON

Connect With Us

HEADQUARTERS

Sourceability North America, LLC

9715 Burnet Rd, Ste 200 Austin, TX 78758-5215

FOR GENERAL INQUIRES

Email [email protected]

Phone +1-888-952-9225

Frequently Asked Questions

As part of the category Semiconductors and subcategory Memory ICs, EPCQ64ASI16N optimizes energy distribution in electronic devices. Its FPGA Configuration Flash Memory allows minimizing losses and increasing the overall system efficiency.

As a component of the subcategory Memory ICs, EPCQ64ASI16N ensures stable output voltage even when the load changes. Its makes it a reliable element in multi-level power systems.

You can download the user manual and technical specifications for EPCQ64ASI16N in the documentation section.

FPGA Configuration Flash Memory