CY7C1460KV33-167AXC
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SRAM Chip Sync Single 3.3V 36M-bit 1M x 36 3.4ns 100-Pin TQFP Tray
| Technology | CMOS |
| Width (mm) | 14.0000 |
| Length (mm) | 20.0000 |
| JESD-30 Code | R-PQFP-G100 |
| Memory Width | 36 |
| Package Code | LQFP |
| Package Shape | RECTANGULAR |
| Package Style | FLATPACK, LOW PROFILE |
| Surface Mount | YES |
| Terminal Form | GULL WING |
| J-STD-609 Code | e4 |
| Memory IC Type | ZBT SRAM |
| Operating Mode | SYNCHRONOUS |
| Parallel/Serial | PARALLEL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Temperature Grade | COMMERCIAL |
| Terminal Position | QUAD |
| Additional Feature | PIPELINED ARCHITECTURE |
| Memory Organization | 1MX36 |
| Number of Functions | 1 |
| Number of Terminals | 100 |
| Terminal Pitch (mm) | 0.650 |
| Number of Words Code | 1M |
| Memory Density (bits) | 37748736.0000000000000000 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 1.6000 |
| Supply Voltage-Max (V) | 3.60000 |
| Supply Voltage-Min (V) | 3.13500 |
| Supply Voltage-Nom (V) | 3.3 |
| Number of Words (words) | 1048576.0000000000000000 |
| Moisture Sensitivity Level | 3 |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature-Max (Cel) | 70.0 |
| Operating Temperature-Min (Cel) | 0.0 |
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CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200You can download the user manual and technical specifications for INFINEON TECHNOLOGIES AG CY7C1460KV33-167AXC in the documentation section.
SRAM Chip Sync Single 3.3V 36M-bit 1M x 36 3.4ns 100-Pin TQFP Tray
As part of the category Semiconductors and subcategory Semiconductors, CY7C1460KV33-167AXC optimizes energy distribution in electronic devices. Its SRAM Chip Sync Single 3.3V 36M-bit 1M x 36 3.4ns 100-Pin TQFP Tray allows minimizing losses and increasing the overall system efficiency.
As a component of the subcategory Semiconductors, CY7C1460KV33-167AXC ensures stable output voltage even when the load changes. Its SRAM Chip Sync Single 3.3V 36M-bit 1M x 36 3.4ns 100-Pin TQFP Tray makes it a reliable element in multi-level power systems.
