AS4C256M16D3C-12BIN ALLIANCE MEMORY INC

AS4C256M16D3C-12BIN ALLIANCE MEMORY INC
Availability
Available
AS4C256M16D3C-12BIN Availability: In Stock
Design risk
Low
Design risk
Price trend
Decreasing
Price trend
Lead time
Decreasing
Lead time
15 results found
3240188
3240188 Availability: In Stock
Available
Low
Low
Decreasing
Decreasing
Stable
Stable
2040588111
2040588111 Availability: In Stock
Available
High
High
Stable
Stable
Stable
Stable
LMV321AS5X
LMV321AS5X Availability: In Stock
Available
High
High
Decreasing
Decreasing
Stable
Stable
MAX253ESA+T
MAX253ESA+T Availability: Out of Stock
Constrained
Low
Low
Decreasing
Decreasing
Stable
Stable
0466.375NRHF
0466.375NRHF Availability: Out of Stock
Constrained
Low
Low
Decreasing
Decreasing
Stable
Stable
WR06X1000FTL
WR06X1000FTL Availability: Out of Stock
Unavailable
Low
Low
Decreasing
Decreasing
Decreasing
Decreasing
MAX3443EESA+T
MAX3443EESA+T Availability: Out of Stock
Unavailable
Low
Low
Increasing
Increasing
Increasing
Increasing
SMV1130-079LF
SMV1130-079LF Availability: In Stock
Available
High
High
Stable
Stable
Stable
Stable
ACPL-332J-500E
ACPL-332J-500E Availability: In Stock
Available
Low
Low
Increasing
Increasing
Decreasing
Decreasing
LM5116MHX/NOPB
LM5116MHX/NOPB Availability: Out of Stock
Constrained
Low
Low
Stable
Stable
Stable
Stable
TLIN10285DRBRQ1
TLIN10285DRBRQ1 Availability: In Stock
Available
Medium
Medium
Decreasing
Decreasing
Stable
Stable
AD8605ARTZ-REEL...
AD8605ARTZ-REEL7 Availability: Out of Stock
Constrained
Low
Low
Increasing
Increasing
Stable
Stable
SIP32462DB-T2-G...
SIP32462DB-T2-GE1 Availability: In Stock
Available
Medium
Medium
Decreasing
Decreasing
Increasing
Increasing
ADM2587EBRWZ-RE...
ADM2587EBRWZ-REEL7 Availability: Out of Stock
Constrained
Low
Low
Decreasing
Decreasing
Increasing
Increasing
MT29F8G08ABACAW...
MT29F8G08ABACAWP-IT:C Availability: In Stock
Available
Medium
Medium
Increasing
Increasing
Increasing
Increasing

Semiconductors

Semiconductors

Lead Time     16 weeks

Datasheet

    Download AS4C256M16D3C-12BIN datasheet AS4C256M16D3C-12BIN

DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA Tray

Technical Data

Manufacturer alliance memory inc
MPN AS4C256M16D3C-12BIN
I/O Type COMMON
Technology CMOS
Width (mm) 7.5000
Access Mode MULTI BANK PAGE BURST
Length (mm) 13.5000
JESD-30 Code R-PBGA-B96
Memory Width 16.0000
Package Code TFBGA
Self Refresh YES
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Form BALL
J-STD-609 Code e1
Memory IC Type DDR3 DRAM
Operating Mode SYNCHRONOUS
Refresh Cycles 8192.0000
Number of Ports 1.0000
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Temperature Grade INDUSTRIAL
Terminal Position BOTTOM
Memory Organization 256MX16
Number of Functions 1.0000
Number of Terminals 96.0000
Terminal Pitch (mm) 0.8000
Number of Words Code 256M
Memory Density (bits) 4294967296.0000
Package Body Material PLASTIC/EPOXY
Output Characteristics 3-STATE
Seated Height-Max (mm) 1.2000
Supply Voltage-Max (V) 1.5750
Supply Voltage-Min (V) 1.4250
Supply Voltage-Nom (V) 1.5000
Number of Words (words) 268435456.0000
Sequential Burst Length 4,8
Standby Current-Max (A) 0.0080
Standby Voltage-Min (V) 1.4250
Supply Current-Max (mA) 190.0000
Interleaved Burst Length 4,8
Package Equivalence Code BGA96,9X16,32
Clock Frequency-Max (MHz) 800.0000
Moisture Sensitivity Level 3.0000
Peak Reflow Temperature (Cel) 260.0000
Operating Temperature-Max (Cel) 95.0000
Operating Temperature-Min (Cel) -40.0000
Time@Peak Reflow Temperature-Max (s) 30.0000
Availability In stock

Submit Request

CONTACT REASON

Connect With Us

HEADQUARTERS

Sourceability North America, LLC

9715 Burnet Rd, Ste 200 Austin, TX 78758-5215

FOR GENERAL INQUIRES

Email [email protected]

Phone +1-888-952-9225

Frequently Asked Questions

As part of the category Semiconductors and subcategory Semiconductors, AS4C256M16D3C-12BIN optimizes energy distribution in electronic devices. Its DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA Tray allows minimizing losses and increasing the overall system efficiency.

As a component of the subcategory Semiconductors, AS4C256M16D3C-12BIN ensures stable output voltage even when the load changes. Its makes it a reliable element in multi-level power systems.

You can download the user manual and technical specifications for AS4C256M16D3C-12BIN in the documentation section.

DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA Tray

AO3406