MCIMX6U5EVM10AC
Availability
Design risk
Price trend
Lead time
| Technology | CMOS |
| Width (mm) | 21 |
| Length (mm) | 21 |
| JESD-30 Code | S-PBGA-B2240 |
| Package Code | LFBGA |
| Package Shape | SQUARE |
| Package Style (Meter) | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Surface Mount | YES |
| Terminal Form | BALL |
| J-STD-609 Code | e1 |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Position | BOTTOM |
| Number of Terminals | 2240 |
| Terminal Pitch (mm) | 0.8 |
| Package Body Material | PLASTIC/EPOXY |
| Seated Height-Max (mm) | 1.5 |
| Moisture Sensitivity Level | 3 |
| uPs/uCs/Peripheral ICs Type | SoC |
Submit request
CONTACT REASON
Sourceability North America, LLC
9715 Burnet Rd, Ste 200